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| TSOP52.. Vishay Telefunken Photo Module for High Data Rates PCM Remote Control Systems Available types for different carrier frequencies Type TSOP5230 TSOP5236 TSOP5238 TSOP5256 fo 30 kHz 36 kHz 38 kHz 56 kHz Type TSOP5233 TSOP5237 TSOP5240 fo 33 kHz 36.7 kHz 40 kHz Description The TSOP52.. - series are miniaturized SMD-IR Receiver Modules for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter. The demodulated output signal can directly be decoded by a microprocessor. TSOP52.. is the standard IR remote control SMD-Receiver series, supporting all major transmission codes. 16797 Features D Photo detector and preamplifier in one package D Internal filter for PCM frequency D Continuous data transmission possible D TTL and CMOS compatibility D Output active low D Low power consumption D High immunity against ambient light D Suitable burst length 10 cycles/burst D Taping available for topview and sideview assembly Block Diagram 4 Input Control Circuit VS 30 kW 3 OUT PIN AGC Band Pass Demodulator 1 GND 16798 Document Number 82154 Rev. 1, 08-Mar-01 www.vishay.com 1 (8) TSOP52.. Vishay Telefunken Absolute Maximum Ratings Tamb = 25_C Parameter Supply Voltage Supply Current Output Voltage Output Current Junction Temperature Storage Temperature Range Operating Temperature Range Power Consumption Test Conditions Pin 4 Pin 4 Pin 3 Pin 3 Symbol VS IS VO IO Tj Tstg Tamb Ptot Value -0.3...6.0 5 -0.3...6.0 15 100 -40...+85 -25...+85 50 Unit V mA V mA C C C mW Tambx 85C Basic Characteristics Tamb = 25_C Parameter Su ly Supply Current Supply Voltage Transmission Distance Output Voltage Low (Pin 3) Irradiance (30-40 kHz) Irradiance (56 kHz) Irradiance Directivity Test Conditions VS = 5 V, Ev = 0 VS = 5 V, Ev = 40 klx, sunlight Ev = 0, test signal see fig.7, IR diode TSAL6200, IF = 400 mA IOSL = 0.5 mA,Ee = 0.7 mW/m2 Pulse width tolerance: tpii - 5/fo < tpo < tpii + 6/fo, test signal see fig.7 tpi - 5/fo < tpo < tpi + 6/fo Angle of half transmission distance Symbol ISD ISH VS d VOSL Ee min Ee min Ee max 1/2 30 50 Min 0.8 4.5 30 250 0.6 0.7 Typ 1.1 1.4 Max 1.5 5.5 Unit mA mA V m mV mW/m 2 mW/m 2 W/m 2 deg 0.5 0.6 Application Circuit 100 W *) 4 TSOP52.. TSAL62.. 3 2 1 16799 + 5V >10 kW optional 4.7 mF *) mC N.C. **) GND *) recommended to suppress power supply disturbances **) the output voltage should not be hold continuously at a voltage below 3.3V by the external circuit. www.vishay.com 2 (8) Document Number 82154 Rev. 1, 08-Mar-01 TSOP52.. Vishay Telefunken Suitable Data Format The circuit of the TSOP52.. is designed in that way that unexpected output pulses due to noise or disturbance signals are avoided. A bandpassfilter, an integrator stage and an automatic gain control are used to suppress such disturbances. The distinguishing mark between data signal and disturbance signal are carrier frequency, burst length and duty cycle. The data signal should fullfill the following condition: * Carrier frequency should be close to center frequency of the bandpass (e.g. 38kHz). * Burst length should be 10 cycles/burst or longer. * After each burst which is between 10 cycles and 70 cycles a gap time of at least 14 cycles is necessary. * For each burst which is longer than 1.8ms a corresponding gap time is necessary at some time in the data stream. This gap time should be at least 4 times longer than the burst. * Up to 800 short bursts per second can be received continuously. Some examples for suitable data format are: NEC Code, Toshiba Micom Format, Sharp Code, RC5 Code, RC6 Code, R-2000 Code. When a disturbance signal is applied to the TSOP52.. it can still receive the data signal. However the sensitivity is reduced to that level that no unexpected pulses will occure. Some examples for such disturbance signals which are suppressed by the TSOP52.. are: * DC light (e.g. from tungsten bulb or sunlight) * Continuous signal at 38kHz or at any other frequency * Signals from fluorescent lamps with electronic ballast with high or low modulation (see Figure A or Figure B). 0 5 10 time [ms] 15 20 Figure A: IR Signal from Fluorescent Lamp with low Modulation 0 5 10 time [s] 15 20 Figure B: IR Signal from Fluorescent Lamp with high Modulation Document Number 82154 Rev. 1, 08-Mar-01 www.vishay.com 3 (8) TSOP52.. Vishay Telefunken Typical Characteristics (Tamb = 25_C unless otherwise specified) E e min - Threshold Irradiance (mW/m2 ) 1.2 1.3 16802 1.0 /e E - Rel. Responsitivity 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 0.5 1.0 1.5 E - Field Strength of Disturbance (kV/m) 2.0 0.8 0.6 0.4 0.2 0.0 0.7 0.8 0.9 1.0 1.1 E e min f = f0"5% Df ( 3 dB ) = f0 / 10 94 8143 f / f0 - Relative Frequency Figure 1. Frequency Dependence of Responsivity Figure 4. Threshold Irradiance vs. Field Strength of Disturbance Ee min - Threshold Irradiance ( mW/m2 ) 10 f = f0 1 kHz 1.0 0.9 tpo - Output Pulse Length (ms) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.1 96 12110 Input burst duration 10 kHz 1 l = 950 nm, optical test signal, fig.7 100 Hz 1.0 10.0 100.0 1000.0 10000.0 94 9106 0.1 0.01 0.1 1 10 100 1000 Ee - Irradiance ( mW/m2 ) DVs RMS - AC Voltage on DC Supply Voltage ( mV ) Figure 2. Sensitivity in Dark Ambient 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0.01 0.10 1.00 10.00 E - DC Irradiance (W/m2) 100.00 Ambient, l = 950 nm Correlation with ambient light sources ( Disturbance effect ) : 10W/m2^1.4 klx ( Stand.illum.A,T = 2855 K )^8.2 klx ( Daylight, T = 5900 K ) Figure 5. Sensitivity vs. Supply Voltage Disturbances 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -30 -15 0 15 30 45 60 75 Tamb - Ambient Temperature ( C ) 90 Sensitivity in dark ambient E e min - Threshold Irradiance (mW/m2 ) 96 12111 96 12112 Figure 3. Sensitivity in Bright Ambient E e min - Threshold Irradiance (mW/m2 ) Figure 6. Sensitivity vs. Ambient Temperature www.vishay.com 4 (8) Document Number 82154 Rev. 1, 08-Mar-01 TSOP52.. Vishay Telefunken Optical Test Signal Ee (IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, T = 10 ms) 1.0 Ton ,T - Output Pulse Length (ms) off 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.1 1.0 10.0 100.0 1000.0 10000.0 l = 950 nm, optical test signal, fig.8 Toff Ton t tpi * T * tpi w 10/fo is recommended for optimal function Output Signal 1) 2) 16110 VO VOH VOL 7/f0 < td < 15/f0 tpo = tpi " 6/f0 t td1 ) 96 12114 Ee - Irradiance (mW/m2) tpo2 ) Figure 7. Output Function S ( l )rel - Relative Spectral Sensitivity Ee Optical Test Signal 1.2 1.0 0.8 0.6 0.4 0.2 Figure 10. Output Pulse Diagram 600 ms T = 60 ms 600 ms t 94 8134 VO VOH VOL Output Signal, ( see Fig.10 ) 0 750 Ton Toff t 94 8408 850 950 1050 1150 l - Wavelength ( nm ) Figure 8. Output Function 0.8 0.7 Envelope Duty Cycle 0.6 0.5 0.4 0.3 0.2 Figure 11. Relative Spectral Sensitivity vs. Wavelength 0 10 20 30 f = 38 kHz 40 1.0 0.9 0.8 0.7 50 60 70 80 0.6 16801 0.1 0 10 16156 20 30 40 50 60 70 80 Burstlength [number of cycles/burst] 90 0.6 0.4 0.2 0 0.2 0.4 drel - Relative Transmission Distance Figure 9. Max. Envelope Duty Cycle vs. Burstlength Figure 12. Directivity Document Number 82154 Rev. 1, 08-Mar-01 www.vishay.com 5 (8) TSOP52.. Vishay Telefunken Operating Instructions Reflow Soldering D Reflow soldering must be done within 48 hours stored under max. 30C, 80% RH after opening envelop D Recommended soldering paste (composition: SN 63%, Pb 37%) Melting temperature 178 to 192C D Apply solder paste to the specified soldering pads, by using a dispenser or by screen printing. D Recommended thickness of metal mask is 0.2 mm for screen printing. D The recommended reflow furnace is a combinationtype with upper and lower heaters. D Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown below. Excercise extreme care to keep the maximum temperature below 230_C. The following temperature profile means the tempera- ture at the device surface. Since temperature differ- ence occurs between the work and the surface of the circuit board depending on the pes of circuit board or reflow furnace, the operating conditions should be verified prior to start of operation. D Handling after reflow should be done only after the work surface has been cooled off. 300 max. 240 C 250 215 C 200 Temperature ( C ) Manual Soldering D Use the 6/4 solder or the solder containing silver. D Use a soldering iron of 25 W or smaller. Adjust the temperature of the soldering iron below 300_C. D Finish soldering within three seconds. D Handle products only after the temperature is cooled off. Cleaning D Perform cleaning after soldering strictly in conformance to the following conditions: Cleaning agent: 2-propanol (isopropyl alcohol). Commercially available grades (industrial use) should be used. Demineralized or distilled water having a resistivity of not less than 500 mW corresponding to a conductivity of 2 mS/m. D Temperature and time: 30 seconds under the temperature below 50_C or 3 minutes below 30_C. D Ultrasonic cleaning: Below 20 W. 94 8625 ca. 230 C 10 s 150 max. 160 C max. 40 s 100 90 - 120 s full line : typical dotted line : process limits 50 2-4 K / s Lead Temperature 0 50 100 Time ( s ) 150 200 250 www.vishay.com 6 (8) Document Number 82154 Rev. 1, 08-Mar-01 TSOP52.. Vishay Telefunken Dimensions in mm 16776 Document Number 82154 Rev. 1, 08-Mar-01 www.vishay.com 7 (8) TSOP52.. Vishay Telefunken Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 )7131 67 2831, Fax number: 49 ( 0 )7131 67 2423 www.vishay.com 8 (8) Document Number 82154 Rev. 1, 08-Mar-01 |
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